Semiconductor

Cutting, drilling and marking of wafers and substrates.

Glass wafers and packaging substrates are cut with the picosecond laser. The UV laser drills micro holes and blind holes in silicon wafers and marks QR codes on LCD glass.

Typical applications

Glass wafers
Packaging substrates
Micro holes and blind holes in silicon wafers
QR codes on LCD glass

Recommended machines

Cuts glass wafers and packaging substrates; CCD camera with 0.7–4.5× zoom lens for positioning.

Picosecond laser glass cutting machine

Cold-cut glass to ±15 μm: no heat-affected zone, no micro-cracks

Drills micro and blind holes in silicon wafers and marks QR codes on LCD glass, with ≤ ±0.002 mm laser repeatability.

UV laser marking machine

Finer, cleaner and more permanent than inkjet coding, with no ink and no waste

Not sure which machine fits?

Send us your drawings, glass types and thicknesses. We will recommend a machine and can run sample tests on your parts.